![]() ![]() Today debuts our formal thermal paste quantity testing - not just method of application, but amount - and looks specifically at the more common desktop CPUs. ![]() We have formally tested this for Threadripper (which cares about IHS coverage greatly) and X99 CPUs, but not for smaller desktop SKUs. As we mentioned in our Threadripper paste application comparison, the general consensus for smaller desktop CPUs is that, as long as enough paste is applied to cover the IHS, every method is basically the same. On the other hand, as it is not electrically conductive, it can also be applied between the thermistor and the heating block and between the heating cartridge and the block, thus favouring heat transfer and providing more precise heating and greater thermal stability.īoron nitride thermal paste is undoubtedly one of the most efficient and versatile thermal pastes available today and the recommended choice for high performance hotends.The “correct” method for applying thermal paste is still the subject of arguments, despite plenty of articles with testing and hard numbers to back them up. On the one hand, its high lubricity and thermal resistance up to 1000 ✬, makes it possible to use it as a lubricant between the nozzle and the heat block, facilitating changes and improving heat transfer between both components. Source: Īll these properties mean that this thermal paste has, in addition to improving heat transfer between the heat brek and the heatsink, other applications that help to obtain the best performance from the hotend. Image 2: Application area of thermal paste in a heat break. In addition, boron nitride has a high lubricity, which facilitates the separation of components for cleaning. While in traditional thermal pastes it is not recommended to use them above 150 ✬ - 180 ✬, Slice Engineering's thermal boron nitride paste i s able to withstand working temperatures of up to 1000 ✬. This results in greater contact between particles, thus achieving a thermal conductivity of 31.4 W/mK, four times higher than that of traditional thermal pastes.Īnother important difference is its excellent resistance to high temperatures. Firstly, despite having a similar consistency to other thermal pastes, once applied it must be left to dry, forming a solid interface between the components. The thermal paste based on boron nitride has important advantages over traditional thermal pastes. It is a thermal paste based on boron nitride, a crystalline refractory compound with a low packing factor that gives it a high thermal conductivity. Slice Engineering, a manufacturer renowned for its high performance Mosquito and Copperhead hotends, has developed an innovative product to match its hotends. In addition, the higher performance computer thermal pastes usually have a thermal conductivity below 10 W/mK. On the other hand, the high temperatures reached in the hotend cause the thermal paste to dry quite quickly, which usually causes the heat break to stick to the heatsink, making it difficult to separate it for a new application. On the one hand, it is optimized for the working temperatures of CPUs or GPUs, which are usually between 60✬ and 90✬, lower than those that can be reached in a hotend, especially when using high temperature materials. ![]() Source: Īlthough it is common to use computer thermal paste, this has some drawbacks. This is why it is essential to apply thermal paste between the heat break and the heatsink, to favour heat transmission and keep the cold zone of the hot end properly cooled. This phenomenon is especially common when PLA is combined with an all-metal hot end that has inadequate thermal performance. This causes an overheating of the cold zone resulting in clogging and inconsistent extrusion as well as the dreaded "heat creep" effect, where the filament melts inside the heat break causing a clogging that is difficult to solve. One of the most important factors for the correct functioning of the hotend is that its thermal performance is optimal.Ī low thermal conductivity between the heat break and the heatsink can cause the heat transfer between both components to be lower than between the heating block and the heat break.
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